Bakit EK neu

Product information of the company:

solvent-free and very low emission
contains no silicon or isocyanate
suitable for hard to adhere wood
one-component, ready to use
bridges cracks with engineered wood
cures to elastic bond layer
easy handling and spreading
suitable over floor heating systems
very low emission EC1R according to GEV
0,0 g/L VOC
contributes to LEED

Solvent-, silicon- and isocyanate-free ready to use one-component adhesive for elastic installation of different wood floorings, e.g. solid and engineered wood flooring, prefinished wood flooring in a variety of thicknesses as parquet, plank or strip. Also suitable for sensitive and hard to adhere woods, please contact our Technical Service Department. Suitable for installation on the cement-based screed, Calcium sulphate-based screed, asphalt mastic screed, wood chipboards and substrates prepared with suitable Kiesel levelling compounds.